AI Drives PCB Demand, Boosting Chinese Dry Film Photoresist Market to $1.9B by 2030
CSC Financial research indicates that the global demand for Printed Circuit Boards (PCBs) is undergoing an upgrade cycle, significantly driven by Artificial Intelligence (AI) servers. This trend is expected to accelerate the localization of high-end dry film photoresist, a critical component in PCB manufacturing. The global market for dry film photoresist is projected to reach 13.6 billion RMB (approximately $1.9 billion USD) by the year 2030. This represents a compound annual growth rate (CAGR) of 9.4%. Chinese suppliers are anticipated to play a leading role in this localization effort. The research highlights the increasing importance of domestic production capabilities for advanced electronic components.
AI's exponential growth is creating a powerful demand signal for advanced semiconductor manufacturing infrastructure, including PCBs and their constituent materials like dry film photoresist. This dynamic presents a significant opportunity for domestic Chinese suppliers to capture market share and advance their technological capabilities, potentially reducing reliance on foreign suppliers for critical components. The projected market growth underscores the strategic importance of this sector, suggesting that investments in R&D and manufacturing capacity for high-end photoresists will be crucial for both national economic security and technological competitiveness in the coming decade. This trend aligns with broader global efforts to build resilient supply chains for essential technologies.
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